Magnetron sputtering apparatus

Substrate size:4'Mainly,6'Compatible.

Requirements for thickness uniformity of sputtered metal film: ≤ ±5%.

Target location:4One.

extreme pressure:<6.6×10-6e Pa.

Target size:3Inches.

Sputtering magnetic materials.

The distance between the target and the sample can be adjusted and can be30Swing your head within a certain angle.

configurationload-lock, can be placed5a flat6Inch samples are transported separately by electric motors under high vacuum conditions, and each sample is sequentially sputtered to complete one by one5Sputtering coating.

The sample stage can be heated up to750Degree, rotatable.

Fully automatic vacuum control module.

Gas path:Ar、O₂、N₂.

RF power supply:2One, each one600W.

DC power supply:2One, each one1000W